PK548 (v1.1 ) january 25, 2013 www.xilinx.com 1 pk 548 (v1.1 ) january 25 , 201 3 100% material declaration data sheet for 7 series ffg676 average weight: 7. 882 0 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.388303 4.926 silicon (si) 7440- 21- 3 100.00 basis 0.388303 solder bump 0.018136 0.230 tin (sn) 7440- 31- 5 63.00 basis 0.011426 lead (pb) 7439- 92- 1 37.00 basis 0.006710 solder paste 0.005400 0.069 tin (sn) 7440- 31- 5 96.50 metal 0.005211 silver (ag) 7440- 22- 4 3.00 metal 0.000162 copper (cu) 7440- 50- 8 0.50 metal 0.000027 capacitor 1 0.021600 0.274 ceramic (batio3 type) 12047- 27- 7 70.60 ceramic 0.015250 nickel (ni) 7440- 02- 0 6.70 inner electrode 0.001447 copper (cu) 7440- 50- 8 20.10 outer electrode 0.004342 nickel (ni) 7440- 02- 0 0.80 plating1 0.000173 tin (sn) 7440- 31- 5 1.80 plating2 0.000389 capacitor 2 0.003800 0.04 8 ceramic (batio3 type) 12047- 27- 7 61.70 ceramic 0.00 2345 nickel (ni) 7440- 02- 0 4.89 inner electrode 0.000 186 indium tin oxide 50926- 11- 9 18.30 outer electrode 0.00 0695 copper (cu) 7440- 50- 8 13.40 outer electrode 0.000 509 nickel (ni) 7440- 02- 0 0.49 plating1 0.0000 19 tin (sn) 7440- 31- 5 1.22 plating2 0.0000 46 capacitor 3 0.001200 0.015 ceramic (batio3 type) 12047- 27- 7 66.00 ceramic 0.00 0792 inner electrode (ni) 7440- 02- 0 2.67 inner electrode 0.000 032 outer electrode (cu) 7440- 50- 8 23.33 outer electrode 0.00 0280 plating 1 (ni) 7440- 02- 0 2.33 plating1 0.000 028 plating 2 (sn) 7440- 31- 5 5.67 plating2 0.000 068 ? copyright 201 3 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet ? 7 series ffg676 PK548 (v1.1 ) january 25, 2013 www.xilinx.com 2 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total capacitor 4 0.007360 0.09 3 batio3 type 12047- 27- 7 51.10 ceramic 0.003761 inner electrode(ni) 7440- 02- 0 27.00 inner electrode 0.001987 outer electrode(cu) 7440- 50- 8 16.0 0 outer electrode 0.001178 glass 65997- 17- 3 0.90 0.000066 plating1(ni) 7440- 02- 0 2.00 plating1 0.000147 plating2(sn) 7440- 31- 5 3.00 plating2 0.000221 underfill 0.049000 0.622 bisphenol f/ epichlorohydrin copolymer 9003- 36- 5 20.00 basis 0.009800 phenolic resin trade secret 15.00 basis 0.007350 bisphenol a type liquid epoxy resin 25068- 38- 6 5.00 basis 0.002450 amine type accelerator trade secret 5.00 basis 0.002450 silicon dioxide 60676- 86- 0 51.50 basis 0.025235 carbon black 1333- 86- 4 1.00 basis 0.000490 additives trade secret 2.50 additive 0.001225 lid 4.615000 58.551 copper (cu) 7440- 50- 8 97.94 main material 4.519931 nickel (ni) 8049- 31- 8 2.06 main material 0.095069 lid adhesive 0.115000 1.459 aluminium oxide 1344- 28- 1 70.00 main material 0.080500 dimethyl siloxane, dimethylvinyl - terminated 68083- 19- 2 30.00 main material 0.034500 solder ball 0.564707 7.165 tin (sn) 7440- 31- 5 96.50 main material 0.544942 silver (ag) 7440- 22- 4 3.00 main material 0.016941 copper (cu) 7440- 50- 8 0.50 main material 0.002824 substrate 2.092494 26.548 copper (cu) 7440- 50- 8 40.50 0.847460 tin (sn) 7440- 31- 5 1.13 0.023645 lead (pb) 7439- 92- 1 0.29 0.006068 silver (ag) 7440- 22- 4 0.02 0.000418 bt core n/a 42.70 0.893495 abf n/a 13.17 0.275581 solder mask n/a 2.19 0.045826
100% material declaration data sheet ? 7 series ffg676 PK548 (v1.1 ) january 25, 2013 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and mat erials suppliers (?contractors?). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connectio n with the use of xilinx products . date version description of revisions 03/23/12 1.0 initial xilinx release. 01/25/13 1.1 update substrate component
|
